Semiconductor Industry : Board Design & Production: Semicore, Carinthia

Board Design & Production

Competence centre for development, design

and equipment of circuit boards

Fully automatic controlled assembly

Semicore – your partner for the expert assembly of circuit boards! Benefit from our state-of-the-art competence centre. We can offer fully automatic controlled serial production of even 1000 pieces or more – according to your request – each item in exactly the same quality, deliverable within the shortest time possible.

We pay attention to electromagnetic compatibility (EMC) already during the design process, which brings as a result secure products and saves expensive redesigns.

Prototypes – Single Batch Series – Small Batch Series

Quick, flexible and cost-effective: Due to our controlled, professional manufacturing process we can guarantee also for small series that each board is absolutely identical in quality and function. Especially when time is of the essence our specialists are able to plan, supported by state-of-the-art design and layout programmes, the most cost-effective circuit board for your demand – as prototypes, as single batch series or as small batch series.

Optimal Soldering Process

We evaluate the optimal soldering process for your product, give you advice when evaluating yourself or carry out the soldering with the help of state-of-the-art soldering machines and technologies.

Whether free-hand sketch or already existing circuit diagram. We are the right contact for your requests in the field of board design & production. For further details please contact pcb-service@semicore.at.

Continuous ESD protection concept

It goes without saying that floors, work benches and working garments meet the ESD standards and that we guarantee a proper ESD packing in a pure and ionised atmosphere. Assembly. Our manufacturing in a near clean room condition disposes of two ESSEMTEC placement machines. Those automatic placement machines with easy programming and retooling meet highest quality standards and are optimally adapted for BGA assembly in small and medium batch series. The high quality assembly is possible through our highly qualified staff and through the use of top-quality materials like soldering paste and soldering paste printing, constantly controlled and produced with the help of high precision laser templates. Only then the assembled printed boards are passed on to the reflow soldering process.

Our board designers give help and advice if you have questions about circuit board materials, HF, HV, impedance, surface and temperature resistance, as well as about the layout design or the choice of components.

Material:

standard circuit boards up to 140 °C (permanent load)
standard circuit boards up to 210 °C (permanent load)
high frequency circuit boards up to 210°C (permanent load)
circuit boards usable in humid environment up to 100 % RH and 145 °C (permanent load)
high current circuit boards up to 400 μm Cu
metal core (aluminium)
special material according to demand

Technique:

ultra fine line technology (100μm)
microvias (100 μm)
blind vias (blind holes)
buried vias (holes between internal layers)
impedance defined LP (generally +/- 10%)
pressfit technology

Dimension:

standard material max. 550 x 500 mm (up to 3,2 mm)
multilayer max. 470 x 335 mm (20 layers)

Surface refinement:

hot air levelling:

immersion process with PbSn alloy (lead-coated)
RoHS (Restriction of the use of certain hazardous substances)

chemical Sn; chemical Ag; chemical Ni-Au (ENIG, Electroless Nickle Immersion Gold),
galvanic gold (hard gold)
chemical thick layer gold (for the bonding of gold wires)
Entek Plus (an inorganic solderable surface)
When to use which surface? ... we are happy to give you advice

Lacquer:

Solder resist lacquer: white, yellow, read, green, blue, black
Printing on components: white, yellow, read, green, blue, black